PCB series capabilities

Technical Capabilities


In the following our high tech options for series production (from 2 pcs.).
Click here for Prototypes!

Power-Pool
Capabilities
Power-Pool
w/o Surcharge
PCB Types onesided
doublesided
multilayer 4-30 layers
- - -
Surface

All surfaces
HAL (lead-free)
chem. tin
chem. silver
chem. gold
bond gold (gold/alu)
HAL (lead-free)
minimum
Trackwidth /
Trackspace
50µm 150µm
minimum
Drills
100µm 300µm
Copper Thickness 35µm - 400µm 35µm
Base Material FR4
P97
Rogers 4350
G200
FR4
FR4 Thickness 0.2mm - 5mm 0.5mm - 3,2mm
max. Size
1,2 layers
720mm x 560mm - - -
max. size
Multilayer
635mm x 510mm - - -
Blind Vias
Buried Vias
Microvias
yes - - -
Solderstop green, white, red, blue, black green
peelable Solderstop yes - - -
Marking Print Photosensitive or Silk Screen: white, yellow Silk Screen: white
Carbon Paste yes / better: chem. gold - - -
Press-Fit Technology yes - - -
Gold Contacts yes - - -
Outline Scoring, Milling Milling of Rectangle Outline
Z-Axis Milling yes - - -
Quality Assurance* E-Test, A.O.I., X-Ray E-Test, A.O.I., X-Ray
Certificates UL-Listed UL-Listed
Data Gerber, Eagle, Target, ODB++ Gerber, Eagle, Target, ODB++
Production Time from 48h 8WD

* A.O.I. and X-Ray exclusively for multilayer boards